A leading global provider of hologram augmented reality (AR) technology, WiMi Hologram Cloud Inc.
(NASDAQ: WIMI) (WiMior the Company;), announced today that it has created a quantum dot
micro-scale component for AR/VR displays, a ground-breaking technology that is garnering attention.
This technology is a major enabler for the future of the AR/VR industry because of its exceptional
outdoor use, high brightness, high resolution, and ultra-fast response time.
The creation of the quantum dot micro-scale display component for WiMi had to overcome several
significant technological obstacles at the same time, including two major technological advances. The
first is the surface buckling problem, which is customarily employed in the fabrication of displays
employing highly efficient bandgap materials like gallium nitride (GaN), which typically requires
placement on a silicon or sapphire wafer. Nevertheless, these materials differ in terms of thermal stress
and lattice mismatches, which frequently cause severe buckling on the wafer surface. Buckling can be a
problem in fabrication, particularly in small pixel manufacturing, and it can be very difficult to align
these tiny features for bonding to another silicon wafer. WiMi group created an incredibly thin, highly
deformable, adhesive bonding alloy that can be used to immobilize GaN epitaxial layers in order to solve
the surface buckling issue. They also used a pre-patterned bonding method, which made it possible for
the GaN layer and the new silicon substrate to be aligned more precisely. This innovation guarantees the
quality and functionality of the displays by resolving the alignment issue that arose during fabrication.
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